Application of Liquid-Cooled Load Banks in AI Data Centers

With the rapid expansion of large-model training and intelligent inference industries, the power density of a single cabinet in AI data centers has surged from the traditional 5kW to over 100kW. After the launch of high-end computing chips such as GB200, high-density heat dissipation and power supply stability have become core challenges in computer room construction. Thanks to its high heat-flux simulation capacity, the liquid-cooled load bank has evolved into essential equipment for acceptance inspection and daily maintenance of AI computing hubs. Adopting deionized water or ethylene glycol coolant as heat exchange medium and a closed-loop water cooling circuit to dissipate internal heat, liquid-cooled load banks deliver dozens of times higher heat transfer efficiency than air-cooled counterparts, compatible with two mainstream liquid cooling solutions: cold-plate cooling and immersion cooling.