Trends of Large - scale Application of Liquid Cooled Load Bank in AI Servers and Supercomputing Centers

30kW Liquid Cooled Load Bank

I. Trends of Large - scale Application

(I) Accelerated technological iteration, cold plate and immersion types become mainstream

The technology of Liquid Cooled Load Bank is rapidly iterating towards a more efficient and reliable direction. At present, cold - plate liquid cooling and immersion liquid cooling have become the two most potential technical paths for large - scale application. Cold - plate liquid cooling conducts heat to the cooling liquid through the direct contact between the metal plate and the heating chip, which is suitable for local high heat flux density areas. It has the characteristics of low modification cost and strong compatibility, and is widely used in the heat dissipation of core components such as GPU and CPU of AI servers. Immersion liquid cooling soaks the whole server or core components in insulating cooling liquid, and takes away heat through the phase change or natural convection of the liquid. It has higher heat dissipation efficiency and can meet the heat dissipation needs of higher - power chips, showing significant advantages in large - scale clusters of supercomputing centers. With the further improvement of chip power consumption, the application proportion of immersion liquid cooling is gradually increasing.

(II) Deepening scenario penetration, extending from supercomputing centers to AI data centers

The large - scale application scenarios of Liquid Cooled Load Bank are deeply penetrating from traditional supercomputing centers to AI data centers. Supercomputing centers' pursuit of extreme computing power makes them early practitioners of Liquid Cooled Load Bank technology. For example, the "Tianhe" series of supercomputers in the National Supercomputing Center have adopted liquid cooling solutions on a large scale. Due to the high power consumption characteristics of AI chips, AI data centers have a more urgent demand for Liquid Cooled Load Bank. Large technology companies such as Google, Amazon, and Alibaba Cloud have introduced Liquid Cooled Load Bank technology in their newly built AI data centers to ensure the stable operation of AI large - model training and inference processes. According to relevant data, the global market size of liquid cooling in AI data centers increased by more than 50% year - on - year in 2024, and it is expected that this growth rate will remain high in the next few years.

(III) Improved industrial ecology, gradual maturity of standardization and supply chain

The large - scale application of Liquid Cooled Load Bank is inseparable from the support of a sound industrial ecology. At present, a complete industrial chain is taking shape, ranging from cooling liquid research and development, liquid cooling component manufacturing to system integration services. Leading enterprises, scientific research institutions and standard organizations in the industry are actively promoting the formulation of liquid cooling technology standards, covering interface specifications, performance testing, safety certification and other aspects, providing a unified technical basis for the large - scale application of Liquid Cooled Load Bank. At the same time, the maturity of the supply chain is constantly improving, the production capacity of core components such as cooling liquid, liquid cold plates, pumps and valves is gradually expanding, and the cost is constantly decreasing, laying a solid material foundation for the large - scale deployment of Liquid Cooled Load Bank.